Product Features

1. Excellent Initial Tack & Wide Compatibility
   Specifically formulated for mobile phone, electronics, and display applications with strong immediate adhesion and broad material compatibility.

2. Display Frame & Electronic Assembly
   Optimized for display screen frame bonding and various electronic component assembly applications.

3. Low-Temperature Processing
   100°C application temperature minimizes thermal stress on sensitive electronic components.

4. Precision Bonding Capability
   Suitable for delicate assembly processes requiring controlled adhesive flow and precise placement.

Typical Applications

• Mobile phone display frame bonding

• Electronics component assembly

• Small device internal structural bonding

• Precision instrument assembly

• Display module and screen assembly

Application Guidelines

• Melt Temperature: 100°C (low-temperature processing)

• Ambient Temperature Range: Controlled cleanroom or assembly environment (20–25°C optimal)

• Material Compatibility: Metals, plastics (PC, ABS, PMMA), glass, composite materials

• Application Method: Precision dispensing equipment recommended

• Pressure: Light pressure sufficient for most electronic assemblies

Packaging & Storage

• Form: Granules or pellets (moisture-proof packaging)

• Storage: Store in dry, cool conditions (15–25°C), maintain original sealed packaging

• Shelf Life: 12 months in original sealed packaging

• Special Handling: Recommend moisture-controlled storage for optimal performance